Semiconductor Testing Solution

Case 1

Tier-1 US customer High speed Memory testing

Challenge:

  • Complex data transaction protocol 

  • AC/DC specification table build up @3200@3600@4000

  • High speed handling, from 550Mbps to 4000Mbps


Benefit
to customer

  • Help DH understand device behavior

  • Around-the-clock device bring-up to meet pressing schedule at a high P/C ratio labor/HR

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Case 2

Tier-1 Japan customer MX device

Challenge:

  • High speed mechanism design for docking between system board and LB

  • AD/DA MX testing 

  •  Communicate directly with customer R&D

  •  Tr/Tf measurement on high speed Diff signal

Benefit to customer

  • Help TH win customer’s MP volume 

  • Help DH’s device come to MP

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